Recording the integrated circuit decapsulation process

Article excerpt

azya on X (formerly Twitter) recorded a video of the IC decapsulation process. The hot air gun nozzle is visible in the top-left corner, with the temperature set to ~150°C. This method works great for small chips. On larger dies, some compound often remains in the center, which I remove by boiling in rosin. See the full video in the post here. Always be safe with cutting tools and wear eye protection. Ed.